Sputter Chamber for UV reflecting and anti-reflecting mirrors for next generation optoelectronic devices

A thin film sputter deposition system for sub nanometer-controlled deposition of single and multilayer stacks of various dielectric materials is proposed. Targeted to the specific needs of a highly structural and optical quality multilayer deposition crucial for UV optoelectronic applications, the system will guarantee: high lateral and vertical film uniformity across the layer stack, sharp interfaces, high conformity, full process parameter control, and in-situ thickness monitoring. An additional in-line surface characterization by X-ray photoelectron spectroscopy and electron beam deposition of metal layers will enhance the capability of the sputter system to analyze complex semiconductor/metal/dielectric interfaces and prepare contamination free passivation and contact layers for optoelectronic devices. The deposition system is in particular capable to fabricate high reflective UV dielectric Distributed Bragg Reflectors as required for UV microcavity laser and anti-reflecting films for photodiodes and other optoelectronic devices operating in the UV-wavelength range. The deposition system will promote the development of future ultra-low threshold microcavity and polariton laser through the U.S. Army funded project.